Semiconductor package

ABSTRACT

A semiconductor package includes a redistribution structure including an insulating layer having an upper surface and a lower surface, a redistribution pad and a redistribution pattern on the lower surface of the insulating layer and electrically connected to each other, and a passivation layer on the lower surface of the insulating layer and having an opening exposing at least a portion of the redistribution pad; a semiconductor chip on the redistribution structure and including a connection pad electrically connected to the redistribution pad; an encapsulant on the redistribution structure and encapsulating the semiconductor chip; and a connection bump and a dummy bump on the passivation layer, wherein the redistribution pattern has a width narrower than a width of the redistribution pad, the connection bump vertically overlaps the redistribution pad, and the dummy bump vertically overlaps the redistribution pattern.

CROSS-REFERENCE TO RELATED APPLICATION

Korean Patent Application No. 10-2020-0049741, filed on Apr. 24, 2020,in the Korean Intellectual Property Office, and entitled: “SemiconductorPackage,” is incorporated by reference herein in its entirety.

BACKGROUND 1. Field

Embodiments relate to a semiconductor package.

2. Description of the Related Art

In a semiconductor package, a conductive bump below a redistributionstructure may be used to provide an electrical path for electricallyconnecting the package and a mounting substrate and a thermal path fortransferring heat generated from a semiconductor chip externally. Due tothis characteristic of such a conductive bump, the conductive bump maybe formed on a pad exposed through an opening of a solder resist, andmay not be formed on a circuit pattern redistributing the pad.

SUMMARY

Embodiments are directed to a semiconductor package, including aredistribution structure including an insulating layer having an uppersurface and a lower surface, a redistribution pad and a redistributionpattern on the lower surface of the insulating layer and electricallyconnected to each other, and a passivation layer on the lower surface ofthe insulating layer and having an opening exposing at least a portionof the redistribution pad; a semiconductor chip on the redistributionstructure and including a connection pad electrically connected to theredistribution pad; an encapsulant on the redistribution structure andencapsulating the semiconductor chip; and a connection bump and a dummybump on the passivation layer, wherein the redistribution pattern has awidth narrower than a width of the redistribution pad, the connectionbump vertically overlaps the redistribution pad, and the dummy bumpvertically overlaps the redistribution pattern.

Embodiments are also directed to a semiconductor package, including aredistribution structure including a plurality of redistribution pads, aplurality of redistribution patterns and a plurality of redistributionvias electrically connecting the plurality of redistribution pads toeach other, and a passivation layer covering a lowermost redistributionpad among the plurality of redistribution pads and a lowermostredistribution pattern among the plurality of redistribution patternsand having a first opening exposing at least a portion of the lowermostredistribution pad; a semiconductor chip on the redistribution structureand including a connection pad electrically connected to an uppermostredistribution pad, among the plurality of redistribution pads; anencapsulant on the redistribution structure and encapsulating thesemiconductor chip; a connection bump filling the first opening of thepassivation layer and electrically connected to the lowermostredistribution pad; and a dummy structure including a dummy pad on alower surface of the passivation layer covering the lowermostredistribution pattern, and a dummy bump on the dummy pad.

Embodiments are also directed to a semiconductor package, including aredistribution structure including one or more insulating layers, and aredistribution pad and a redistribution pattern on a lower surface of alowermost insulating layer among the one or more insulating layers andelectrically connected to each other; a semiconductor chip on theredistribution structure and electrically connected to theredistribution pad and the redistribution pattern; a passivation layercovering the redistribution pad and the redistribution pattern andhaving an opening exposing the redistribution pad; a connection bumpdisposed in the opening of the passivation layer; and a dummy bump on alower surface of the passivation layer. A distance between the lowersurface of the lowermost insulating layer and an upper end of theconnection bump may be less than a distance between the lower surface ofthe lowermost insulating layer and an upper end of the dummy bump.

BRIEF DESCRIPTION OF DRAWINGS

Features will become apparent to those of skill in the art by describingin detail example embodiments with reference to the attached drawings inwhich:

FIG. 1A is a bottom view of a semiconductor package according to anexample embodiment.

FIG. 1B is a plan view illustrating an arrangement of the redistributionpad, the redistribution pattern, and the dummy pad in portion A of FIG.1A.

FIG. 2 is a cross-sectional view taken along line I-I′ of thesemiconductor package of FIG. 1A.

FIG. 3 is an enlarged view of portion B of FIG. 2.

FIG. 4 is an enlarged view of portion B′ according to an exampleembodiment.

FIG. 5 is a cross-sectional view illustrating a semiconductor packageaccording to an example embodiment.

FIG. 6 is an enlarged view of portion C of FIG. 5.

FIG. 7 is an enlarged view of portion C′ according to an exampleembodiment.

FIG. 8 is a cross-sectional view illustrating a semiconductor packageaccording to an example embodiment.

FIG. 9 is a cross-sectional view illustrating a semiconductor packageaccording to an example embodiment.

FIG. 10 is a cross-sectional view illustrating a semiconductor packageaccording to an example embodiment.

FIG. 11 is a cross-sectional view illustrating a semiconductor packageaccording to an example embodiment.

FIG. 12 is a cross-sectional view illustrating a state in which thesemiconductor package of FIG. 2 is mounted on a substrate.

FIGS. 13 to 15 are cross-sectional views schematically illustrating amethod of manufacturing the connection bump and the dummy bump in thesemiconductor package of FIG. 2.

DETAILED DESCRIPTION

FIG. 1A is a bottom view of a semiconductor package according to anexample embodiment. FIG. 1B is a plan view illustrating an arrangementof the redistribution pad, the redistribution pattern, and the dummy padin portion A of FIG. 1A. FIG. 2 is a cross-sectional view taken alongline I-I′ of the semiconductor package of FIG. 1A. FIG. 3 is an enlargedview of portion B of FIG. 2. FIG. 4 is an enlarged view of portion B′according to an example embodiment. The portion B′ represents a portioncorresponding to the portion B of FIG. 3 in an example embodiment.

Referring to FIGS. 1A to 3, a semiconductor package 100A according to anexample embodiment may include a redistribution structure 110 thatextends in first and second directions D1, D2, a semiconductor chip 120stacked on the redistribution structure 110 in a third direction D3, anencapsulant 130 surrounding the semiconductor chip, a connection bump140 at lower surface of the redistribution structure 110 that isopposite in the third direction D3 from an upper surface to which thesemiconductor chip 120 is attached, and a dummy structure 150.

The redistribution structure 110 may include an insulating layer 111having an upper surface and a lower surface S1 that are opposite to eachother in the third direction D3, a redistribution pad 112 b and aredistribution pattern 114 on the lower surface S1 of the insulatinglayer 111 and electrically connected to each other (see FIG. 1B), and apassivation layer 115 on the upper surface and the lower surface S1 ofthe insulating layer 111 and having an opening 115 h at the lowersurface S1 of the insulating layer 111 that exposes at least a portionof the redistribution pad 112 b.

The redistribution structure 110 may further include a redistributionpad 112 a on the upper surface of the insulating layer 111, and aredistribution via 113 passing through the insulating layer 111 andelectrically connecting the redistribution pad 112 a on the uppersurface of the insulating layer 111 and the redistribution pad 112 b onthe lower surface S1 of the insulating layer 111. The redistributionstructure 110 may include, for example, a plurality of redistributionpads 112 a and 112 b, a plurality of redistribution patterns 114 and aplurality of redistribution via 113 electrically connecting theplurality of redistribution pads 112 a and 112 b to each other, and apassivation layer 115 covering a lowermost redistribution pad 112 bamong the plurality of redistribution pads 112 a and 112 b and alowermost redistribution pattern 114 among the plurality ofredistribution patterns 114 and having a first opening 115 h exposing atleast a portion of the lowermost redistribution pad 112 b. In addition,the insulating layer 111, the redistribution pads 112 a and 112 b, theredistribution via 113, and the redistribution pattern 114 may beincluded in a larger number, as compared to that illustrated in FIG. 1A.In an example embodiment, the redistribution structure 110 may be asubstrate for a semiconductor package, such as a printed circuit board(PCB), a ceramic substrate, a tape wiring board, or the like.

The insulating layer 111 may include an insulating material. Theinsulating material may include a thermosetting resin such as an epoxyresin, a thermoplastic resin such as polyimide, or a resin impregnatedwith an inorganic filler or/and glass fiber, glass cloth, or glassfabric, such as a prepreg, an Ajinomoto build-up film (ABF), a flameretardant-4 (FR-4), and bismaleimide triazine (BT). In animplementation, the insulating material may include silicon, germanium,silicon-germanium, gallium-arsenic (GaAs), glass, or the like.

The redistribution pads 112 a and 112 b may be at opposite surfaces ofthe insulating layer 111, and the redistribution pad 112 a on an upperside and the redistribution pad 112 b on a lower side, based on theinsulating layer 111, may be electrically connected to each other. Theredistribution pad 112 a disposed in an uppermost position of theplurality of redistribution pads 112 a and 112 b on different levels maybe electrically connected to a connection pad 120P of the semiconductorchip 120, and the redistribution pad 112 b disposed in a lowermostposition of the plurality of redistribution pads 112 a and 112 b ondifferent levels may be electrically connected to an external device bythe connection bump 140. The redistribution pads 112 a and 112 b mayinclude a metal material including copper (Cu), aluminum (Al), silver(Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), oralloys thereof. The redistribution pads 112 a and 112 b may performvarious functions according to a design. For example, the redistributionpads 112 a and 112 b may be connected to a ground (GND) pattern, a power(PWR) pattern, and a signal (S) pattern. The signal (S) pattern may be atransmission path of various signals, for example, data signals, exceptfor the ground (GND) pattern and the power (PWR) pattern.

The redistribution via 113 may pass through the insulating layer 111 toelectrically connect the plurality of redistribution pads 112 a and 112b on different levels, to form an electrical path in the redistributionstructure 110. The redistribution via 113 may include a metal material,similar to the redistribution pads 112 a and 112 b. The redistributionvia 113 may have a shape in which the metal material completely fills oris formed along a wall surface of a via hole.

The redistribution pattern 114 may be electrically connected to theredistribution pads 112 a and 112 b on substantially the same level. Forexample, as illustrated in FIG. 1B, the lowermost redistribution pattern114 may be electrically connected to the lowermost redistribution pad112 b and/or the redistribution via 113, and may be located onsubstantially the same level as the lowermost redistribution pad 112 b.The redistribution pattern 114 may be a conductive line electricallyconnecting the redistribution pads 112 a and 112 b on the same level toeach other, and may serve to redistribute the uppermost redistributionpad 112 a directly connected to the semiconductor chip 120 to a fan-outregion. The redistribution pattern 114 may have a width narrower than awidth of each of the redistribution pads 112 a and 112 b having variouscross-sectional shapes, and may include a ground (GND) pattern, a power(PWR) pattern, or a signal (S) pattern according to a design to bedesired. For example, the redistribution pads 112 a and 112 b and theredistribution pattern 114 may have a rectangular verticalcross-sectional shape, wherein the redistribution pattern 114 may have awidth narrower than a width of each of the redistribution pads 112 a and112 b. A horizontal cross-sectional shape of the redistribution pads 112a and 112 b may be, for example, a circular shape, a square shape, or adroplet shape, and the redistribution pattern 114 may be in the form ofa lane extending from one end of the redistribution pads 112 a and 112b.

The passivation layer 115 may be on the uppermost and lowermostredistribution pads 112 a and 112 b and the redistribution pattern 114,and may help to protect them from external physical/chemical damage. Thepassivation layer 115 may have a plurality of openings 115 h exposing atleast a portion of the redistribution pads 112 a and 112 b. Thepassivation layer 115 may include an insulating material, and mayinclude, for example, prepreg, ABF, FR-4, BT, or a photo solder resist.The passivation layer 115 may directly cover the redistribution pads 112a and 112 b and the redistribution pattern 114. The opening 115 h maypass through a portion of the passivation layer 115 that verticallyoverlaps or covers the redistribution pads 112 a and 112 b, and may notbe formed in a region covering the redistribution pattern 114.

The semiconductor chip 120 may have an active surface on which theconnection pad 120P is disposed, and a non-active surface opposite tothe active surface, and may be on the redistribution structure 110. Theconnection pad 120P may be electrically connected to the redistributionpads 112 a and 112 b and the redistribution pattern 114. In an exampleembodiment, the semiconductor chip 120 may be mounted on theredistribution structure 110 in a wire-bonding manner. For example, thesemiconductor chip 120 may be attached to an upper surface of theredistribution structure 110 by an adhesive member 120F on thenon-active surface, and the connection pad 120P may be connected to theuppermost redistribution pad 112 a by a bonding wire 120B.

The adhesive member 120F may be between the semiconductor chip 120 andthe redistribution structure 110, and may fix the semiconductor chip120. The adhesive member 120F may include an adhesive resin such as athermosetting resin. The adhesive resin may include, for example, atleast one of a bisphenol type epoxy resin, a novolak type epoxy resin, aphenol resin, a urea resin, a melamine resin, an unsaturated polyesterresin, and a resorcinol resin. The adhesive member 120F may include adie attach film (DAF).

The semiconductor chip 120 may be an IC chip from a plurality ofintegrated circuits (ICs) formed on a wafer. The semiconductor chip 120may include, for example, one or more of a central processor (CPU), agraphics processor (GPU), a field programmable gate array (FPGA), adigital signal processor, a cryptographic processor, a microprocessor, amicrocontroller, a logic chip such as an analog-to-digital converter andan application-specific IC (ASIC), or a memory chip such as a volatilememory (e.g., DRAM), a non-volatile memory (e.g., ROM), and a flashmemory.

The encapsulant 130 may be on the redistribution structure 110 and mayencapsulate the semiconductor chip 120. The encapsulant 130 may includea polymer material, for example, a thermosetting resin such as an epoxyresin, a thermoplastic resin such as a polyimide, or a prepreg, anAjinomoto build-up film (ABF), a flame retardant-4 (FR-4) material, andbismaleimide triazine (BT), including an inorganic filler or/and glassfiber, glass cloth, or glass fabric.

As illustrated in FIGS. 2 and 3, the connection bump 140 may fill theopening 115 h of the passivation layer 115, and may be connected to thelowermost redistribution pad 112 b exposed through the opening 115 h.The connection bump 140 may vertically overlap the lowermostredistribution pad 112 b in the third direction D3. The lowermostredistribution pad 112 b may be provided as a plurality ofredistribution pads 112 b on the same level to each other, and theopening 115 h may be provided as a plurality of openings 115 hcorresponding to at least a portion of the plurality of redistributionpads 112 b. The connection bump 140 may be provided as a plurality ofconnection bumps 140 disposed in each of the plurality of openings 115h.

The connection bump 140 may physically and/or electrically connect thesemiconductor package 100A and an external device. The connection bump140 may include a low-melting-point metal, for example, tin (Sn) or analloy (Sn—Ag—Cu) containing tin (Sn). The connection bump 140 may have aball shape. The connection bump 140 may provide a heat conduction paththat dissipates heat generated from the semiconductor chip 120, due toproperties of a material, to the outside of the semiconductor package100A.

The connection bump 140 may not be formed on the lowermostredistribution pattern 114. A heat dissipation path for heat todissipate from the semiconductor package 100A may be provided by a dummystructure 150 or a dummy bump 152, e.g., spaced apart from theredistribution pattern 114 and in a region directly below the lowermostredistribution pattern 114. The dummy structure 150 or the dummy bump152 may help improve heat dissipation performance of the semiconductorpackage 100A.

The dummy structure 150 may include a dummy pad 151 on a lower surfaceof the passivation layer 115 covering the lowermost redistributionpattern 114, and a dummy bump 152 on the dummy pad 151.

The dummy pad 151 may have one surface contacting the lower surface ofthe passivation layer 115, and remaining surfaces thereof may be coveredby the dummy bump 152. The dummy pad 151 may be spaced apart from theredistribution pattern 114 by the passivation layer 115, and mayvertically overlap at least a portion of the lowermost redistributionpattern 114 in the third direction D3. The dummy pad 151 may be locatedon a level lower than the lowermost redistribution pad 112 b. The dummypad 151 may include a metal material containing copper (Cu), aluminum(Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium(Ti), or alloys thereof. The dummy pad 151 may help improve adhesion ofthe dummy bump 152 on the passivation layer 115.

The dummy bump 152 may be on the passivation layer 115 and the dummy pad151, and may vertically overlap the lowermost redistribution pattern 114in the third direction D3. The dummy bump 152 may be on the lowersurface of the passivation layer 115 covering the lowermostredistribution pattern 114, and may be electrically insulated from theredistribution pattern 114. The dummy bump 152 may be spaced apart fromthe redistribution pattern 114 by the passivation layer 115. The dummybump 152 may be provided as a plurality of dummy bumps 152 spaced apartfrom the connection bump 140, and at least a portion of the plurality ofdummy bumps 152 may be arranged in a region directly below the lowermostredistribution pattern 114. Remaining portions of the plurality of dummybumps 152 may not vertically overlap the lowermost redistribution pad112 b and the lowermost redistribution pattern 114. The dummy bump 152may be formed by the same process as the connection bump 140, but adistance between the lower surface S1 of the lowermost insulating layer111 and an upper end of the connection bump 140 may be less than adistance between the lower surface S1 of the lowermost insulating layer111 and an upper end of the dummy bump 152. The dummy bump 152 mayinclude the same material as the connection bump 140, for example, tin(Sn) or an alloy (Sn—Ag—Cu) containing tin (Sn). The dummy bump 152 maybe on the lower surface of the passivation layer 115 in which theconnection bump 140 is not disposed, and may provide an additional heatdissipation path.

As illustrated in FIG. 4, an under-bump metal 140M may be providedbetween the connection bump 140 and the lowermost redistribution pad 112b. The under-bump metal 140M may be disposed in the opening 115 h of thepassivation layer 115, and may be electrically connected to thelowermost redistribution pad 112 b. The under-bump metal 140M mayimprove reliability for connection of the connection bump 140, and mayimprove reliability for board level of the package. The under-bump metal140M may be formed by a metallization method, for example. Theunder-bump metal 140M may have a via shape that is curved along an innerwall of the opening 115 h and a lower surface of the passivation layer115, or a filled via shape that fills the opening 115 h.

FIG. 5 is a cross-sectional view illustrating a semiconductor package100B according to an example embodiment, FIG. 6 is an enlarged view ofportion C of FIG. 5, and FIG. 7 is an enlarged view of portion C′according to an example embodiment. The portion C′ represents a portioncorresponding to the portion C of FIG. 6 in an example embodiment.

Referring to FIGS. 5 and 6, a passivation layer 115 below aredistribution structure 110, in a semiconductor package 100B accordingto the present example embodiment, may include a first passivation layer115 a covering a lowermost redistribution pad 112 b and a lowermostredistribution pattern 114, and a second passivation layer 115 b stackedon the first passivation layer 115 a. The passivation layer 115 may havea first opening 115 h 1 passing through both the first and secondpassivation layers 115 a and 115 b, and a second opening 115 h 2 onlypassing through the second passivation layer 115 b (see FIG. 6). Thelowermost redistribution pad 112 b may be on a lower surface S1 of alowermost insulating layer 111, and a dummy pad 151 may be on a lowersurface S2 of the first passivation layer 115 a. The dummy pad 151 maybe between the first passivation layer 115 a and the second passivationlayer 115 b, and at least a portion of the dummy pad 151 may be exposedthrough the second opening 115 h 2. The dummy pad 151 may be located ona level lower than the redistribution pad 112 b exposed by the firstopening 115 h 1, and spaced apart from the lowermost redistributionpattern 114 by the first passivation layer 115 a. The dummy bump 152 mayfill the second opening 115 h 2, and may be in direct contact with thedummy pad 151. The first and second passivation layers 115 a and 115 bmay include the same insulating material, and may be formed by stackingand curing the insulating material. A boundary between the first andsecond passivation layers 115 a and 115 b may be varied or blended.

In an example embodiment, as illustrated in FIG. 7, a dummy under-bumpmetal 150M may be provided between the dummy pad 151 and the dummy bump152. The dummy under-bump metal 150M may be disposed in the secondopening 115 h 2 to connect the dummy pad 151 and the dummy bump 152. Thedummy under-bump metal 150M may improve adhesion of the dummy bump 152.The dummy under-bump metal 150M may be formed by the same process as anunder-bump metal 140M.

Among the components illustrated in FIGS. 5 to 7, components having thesame reference numerals as in FIG. 2 have similar technicalcharacteristics to those illustrated in FIG. 2, and thus descriptionsthereof will be omitted.

FIG. 8 is a cross-sectional view illustrating a semiconductor package100C according to an example embodiment.

Referring to FIG. 8, in a semiconductor package 100C according to thepresent example embodiment, a semiconductor chip 120 may be mounted on aredistribution structure 110 in a flip-chip bonding method. A connectionpad 120P of the semiconductor chip 120 may be connected to an uppermostredistribution pad 112 a by a conductive bump 120B′. The conductive bump120B′ may include a solder ball, or a copper pillar. In addition,although not illustrated in the drawing, an underfill resin surroundingthe conductive bump 120B′ may be between the semiconductor chip 120 andthe redistribution structure 110.

Among the components illustrated in FIG. 8, components having the samereference numerals as in FIG. 2 have similar technical characteristicsto those illustrated in FIG. 2, and thus descriptions thereof will beomitted.

FIG. 9 is a cross-sectional view illustrating a semiconductor package100D according to an example embodiment.

Referring to FIG. 9, in a semiconductor package 100D according to thepresent example embodiment, a redistribution structure 110 may includeone or more insulating layers 111, a plurality of redistribution pads112 a and 112 b and a plurality of redistribution patterns 114respectively on the one or more insulating layers 111, and aredistribution via 113 passing through the one or more insulating layers111 to connect the redistribution pads 112 a and 112 b on differentlevels and/or to connect an uppermost redistribution pad 112 a and aconnection pad 120P. Also, a passivation layer 115 covering both of theredistribution pattern 114 and a redistribution pad 112 b, on a lowersurface of a lowermost insulating layer 111, may be included. Theinsulating layer, and the redistribution pads and patterns of theredistribution structure 110 may be provided in greater or fewer numbersthan those illustrated in the drawing. Redistribution pads andredistribution patterns, not connected to each other in the drawing, maybe connected to each other by bypassing a region not illustrated in thedrawing.

The one or more insulating layers 111 may include a photosensitive resinsuch as PID resin. In this case, the insulating layer 111 may be formedto be relatively thin, and the redistribution via 113 may be finelyformed. When the insulating layer 111 is provided as a plurality ofinsulating layers, the plurality of insulating layers may include thesame material or different materials from each other. In addition, whenthe insulating layer 111 is provided as a plurality of insulatinglayers, a boundary between the plurality of insulating layers 111 may bevaried or blended depending on a process. The redistribution via 113 maybe a filled via, filled with a metal material in a via hole, or aconformal via in which the metal material is formed along an inner wallof the via hole.

In the semiconductor package 100D, a semiconductor chip 120 may be inclose contact with an upper surface of the redistribution structure 110.An active surface of the semiconductor chip 120 may be in contact withan uppermost insulating layer 111 of the redistribution structure 110,and the connection pad 120P may be directly connected to theredistribution via 113. Therefore, reliability for connection of theconnection pad 120P may be improved.

Among the components illustrated in FIG. 9, components having the samereference numerals as in FIG. 2 have similar technical characteristicsto those illustrated in FIG. 2, and thus descriptions thereof will beomitted.

FIG. 10 is a cross-sectional view illustrating a semiconductor package100E according to an example embodiment.

Referring to FIG. 10, a semiconductor package 100E according to thepresent example embodiment may include a vertical connection structure160 on a redistribution structure 110 and having a through-hole 160Haccommodating a semiconductor chip 120. The vertical connectionstructure 160 may include an insulating layer 161, a plurality of wiringlayers 162 a and 162 b on the upper and lower surfaces of the insulatinglayer 161, respectively, and a wiring via 163 passing through theinsulating layer 161 and electrically connecting the plurality of wiringlayers 162 a and 162 b. The insulating layer, the wiring layer, and thewiring via may be included in a larger number, as compared to thoseillustrated in the drawing.

The vertical connection structure 160 may improve stiffness of thesemiconductor package 100E according to a specific material of theinsulating layer 161, and ensure uniform thickness of an encapsulant130. The vertical connection structure 160 may have the through-hole160H passing through the insulating layer 161. The semiconductor chip120 may be disposed in the through-hole 160H. The through-hole 110H mayhave a shape in which a wall surface thereof surrounds the semiconductorchip 120, for example.

A material of the insulating layer 161 may be, for example, aninsulating material, and as the insulating material, a thermosettingresin such as an epoxy resin, a thermoplastic resin such as polyimide,or a resin in which these resins are mixed with an inorganic filler, forexample, an Ajinomoto build-up film (ABF). In an implementation, glassfiber, glass cloth, or glass fabric impregnated with the above-describedresin may be used together with an inorganic filler, for example, aprepreg.

The wiring layers 162 a and 162 b may provide upper and lower electricalconnection paths of the package together with the wiring via 163, andmay serve to redistribute a connection pad 120P. The wiring layers 162 aand 162 b may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn),gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. Thewiring layers 162 a and 162 b may include a ground (GND) pattern, apower (PWR) pattern, and a signal (S) pattern according to a design of acorresponding layer. In addition, the wiring layers 162 a and 162 b mayinclude various types of via pads and the like, respectively. The wiringlayers 162 a and 162 b may be formed by a plating process, and may becomposed of a seed layer and a conductor layer, respectively.

The wiring via 163 may electrically connect the wiring layers 162 a and162 b formed on different layers, and as a result, an electrical pathmay be formed in the vertical connection structure 160. The wiring via163 may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold(Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. Thewiring via 163 may include a signal via, a power via, and a ground via,and the power via and the ground via may be the same via. The wiring via163 may be a field-type via filled with a metal material, or aconformal-type via in which the metal material is formed along a wallsurface of a via hole. The wiring via 163 may be formed by a platingprocess, and may be composed of a seed layer and a conductor layer.

A second package 200 may be coupled on the semiconductor package 100E.The second package 200 may include a second redistribution structure210, a second semiconductor chip 220, and a second encapsulant 230.

The second redistribution structure 210 may include redistribution pads211 and 212 respectively on upper and lower surfaces of the secondredistribution structure 210 and electrically connected to the outside,and a redistribution pattern 213 disposed in the second redistributionstructure 210 and connecting the redistribution pads 211 and 212. Theredistribution pattern 213 may redistribute a connection pad 220P of thesecond semiconductor chip 220 to a fan-out region.

The second semiconductor chip 220 may include the connection pad 220P,and the connection pad 220P may be electrically connected to the secondredistribution structure 210 by a metal bump 220B. The second package200 may further include an underfill material surrounding the metal bump220B. The underfill material may be an insulating material including anepoxy resin or the like. The metal bump 220B may include a solder ballor a copper pillar.

In another implementation, similar to that illustrated in FIG. 9, theconnection pad 220P of the second semiconductor chip 220 in FIG. 10 maybe in contact with the upper surface of the second redistributionstructure 210 and may be electrically connected to the redistributionpattern 213 by a via in the second redistribution structure 210.

The second encapsulant 230 may include the same material as, or amaterial similar to, the encapsulant 130 of the first semiconductorpackage 100E.

The second package 200 may be physically/electrically connected to thesemiconductor package 100E by a second connection bump 240. The secondconnection bump 240 may be electrically connected to the redistributionpattern 213 in the second redistribution structure 210 by theredistribution pad 211 on the lower surface of the second redistributionstructure 210. The second connection bump 240 may be made of alow-melting-point metal, for example, tin (Sn) or an alloy containingtin (Sn). For example, the second connection bump 240 may be formed of asolder or the like.

Among the components illustrated in FIG. 10, components having the samereference numerals as in FIG. 2 have similar technical characteristicsto those illustrated in FIG. 2, and thus descriptions thereof will beomitted.

FIG. 11 is a cross-sectional view illustrating a semiconductor package100F according to an example embodiment.

Referring to FIG. 11, a semiconductor package 100F according to thepresent example embodiment may include a second redistribution structure170 on an encapsulant 130, a vertical connection structure 160′electrically connecting the second redistribution structure 170 and afirst redistribution structure 110, and a second dummy structure 150-2on the second redistribution structure 170.

The second redistribution structure 170 may include a second insulatinglayer 171, second redistribution pads 172 a and 172 b, a secondredistribution via 173, a second redistribution pattern 174, and asecond passivation layer 175. Components of the second redistributionstructure 170 may have substantially the same technical characteristicsas components of the first redistribution structure 110. Unlike asillustrated in the drawing, a lower surface of the second redistributionstructure 170 may be spaced apart from an upper surface of theencapsulant 130, and the second passivation layer 175 may be also on alower surface of the insulating layer 171.

The vertical connection structure 160′ may pass through the encapsulant130, and may electrically connect an uppermost redistribution pad 112 aof the first redistribution structure 110 and a lowermost redistributionpad 172 a of the second redistribution structure 170. A plurality ofvertical connection structures 160′ may be provided to surround asemiconductor chip 120. The vertical connection structure 160′ mayinclude a solder ball, a pillar, a core ball, or the like. The verticalconnection structure 160′ may have a core ball structure including acore 161′ formed in a central portion and a solder layer 162′ coveringthe core 161′. The core 161′ may include a polymer material including athermoplastic resin and a thermosetting resin, or a metal material,distinct from solder. The solder layer 162′ may include tin (Sn) or analloy containing tin (Sn).

The second dummy structure 150-2 may include a second dummy pad 151-2and a second dummy bump 152-2. The second dummy pad 151-2 may be on anupper surface of the second passivation layer 175 to vertically overlapan uppermost second redistribution pattern 174, and the second dummybump 152-2 may be on the second dummy pad 151-2. The second dummystructure 150-2 may provide a heat dissipation path in a region in whicha second connection bump 240 is not disposed. The second dummy structure150-2 may have substantially the same technical characteristics as afirst dummy structure 150-1.

Among the components illustrated in FIG. 11, components having the samereference numerals as in FIG. 2 have similar technical characteristicsto those illustrated in FIG. 2, and thus descriptions thereof will beomitted.

FIG. 12 is a cross-sectional view illustrating a state in which thesemiconductor package 100A of FIG. 2 is mounted on a substrate.

Referring to FIG. 12, a first pad 21 connected to the connection bump140 and a second pad 22 connected to the dummy bump 152 may be on anupper surface of a mounting substrate 20. The connection bump 140 may beconnected to the first pad 21, and may provide a primary heat transferpath h1. An additional heat transfer path h2 may be provided through thedummy bump 152. In an implementation, the second pad 22 connected to thedummy bump 152 may be omitted.

FIGS. 13 to 15 are cross-sectional views schematically illustrating amethod of manufacturing the connection bump 140 and the dummy structure150 in the semiconductor package 100A of FIG. 2.

Referring to FIG. 13, a semiconductor chip 120 and an encapsulant 130may be formed on a redistribution structure 110, and a carrier film 10may be attached to the encapsulant 130. A dummy pad 151 may be formed onan upper surface of the redistribution structure 110. The dummy pad 151may be formed by an electroless plating process and/or an electrolyticplating process, after patterning a dry film. The dummy pad 151 may beformed in a region directly on a redistribution pattern 114.

Referring to FIG. 14, an opening 115 h passing through a passivationlayer 115 to expose a redistribution pad 112 b may be formed. Theopening 115 h may be provided as a plurality of openings, correspondingto the redistribution pad 112 b. The opening 115 h may be formed by aphysical or/and chemical process. For example, the opening 115 h may beformed using a laser drill.

Referring to FIG. 15, a connection bump 140 filling the opening 115 hand a dummy bump 152 covering the dummy pad 151 may be formed. Aconnection bump 140 and the dummy pad 151 may be formed in the samereflow process as each other, and may include the same material.

As described above, in an example embodiment, a dummy bump may be formedin a portion of a solder resist covering a circuit pattern, and mayprovide a semiconductor package with improved heat dissipationperformance.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present invention asset forth in the following claims.

What is claimed is:
 1. A semiconductor package, comprising: aredistribution structure including an insulating layer having an uppersurface and a lower surface, a redistribution pad and a redistributionpattern on the lower surface of the insulating layer and electricallyconnected to each other, and a passivation layer on the lower surface ofthe insulating layer and having an opening exposing at least a portionof the redistribution pad; a semiconductor chip on the redistributionstructure and including a connection pad electrically connected to theredistribution pad; an encapsulant on the redistribution structure andencapsulating the semiconductor chip; and a connection bump and a dummybump on the passivation layer, wherein: the redistribution pattern has awidth narrower than a width of the redistribution pad, the connectionbump vertically overlaps the redistribution pad, and the dummy bumpvertically overlaps the redistribution pattern.
 2. The semiconductorpackage as claimed in claim 1, wherein the passivation layer is indirect contact with the redistribution pad and the redistributionpattern.
 3. The semiconductor package as claimed in claim 1, wherein:the connection bump is disposed in the opening of the passivation layerand is electrically connected to the redistribution pad, and the dummybump is on a lower surface of the passivation layer covering theredistribution pattern and is electrically insulated from theredistribution pad and the redistribution pattern.
 4. The semiconductorpackage as claimed in claim 1, wherein the dummy bump is spaced apartfrom the redistribution pattern by the passivation layer.
 5. Thesemiconductor package as claimed in claim 1, wherein the connection bumpand the dummy bump include the same material.
 6. The semiconductorpackage as claimed in claim 1, wherein the passivation layer includes aphoto solder resist.
 7. The semiconductor package as claimed in claim 1,further comprising a dummy pad having one surface contacting a lowersurface of the passivation layer and another surface covered by thedummy bump, wherein the dummy pad is spaced apart from theredistribution pattern by the passivation layer.
 8. A semiconductorpackage, comprising: a redistribution structure including a plurality ofredistribution pads, a plurality of redistribution patterns and aplurality of redistribution vias electrically connecting the pluralityof redistribution pads to each other, and a passivation layer covering alowermost redistribution pad among the plurality of redistribution padsand a lowermost redistribution pattern among the plurality ofredistribution patterns and having a first opening exposing at least aportion of the lowermost redistribution pad; a semiconductor chip on theredistribution structure and including a connection pad connected to anuppermost redistribution pad among the plurality of redistribution pads;an encapsulant on the redistribution structure and encapsulating thesemiconductor chip; a connection bump filling the first opening of thepassivation layer and electrically connected to the lowermostredistribution pad; and a dummy structure including a dummy pad on alower surface of the passivation layer covering the lowermostredistribution pattern, and a dummy bump on the dummy pad.
 9. Thesemiconductor package as claimed in claim 8, wherein the lowermostredistribution pad and the lowermost redistribution pattern are locatedon substantially a same level.
 10. The semiconductor package as claimedin claim 8, wherein the dummy pad vertically overlaps at least a portionof the lowermost redistribution pattern.
 11. The semiconductor packageas claimed in claim 8, wherein the dummy pad is located on a level lowerthan the lowermost redistribution pad.
 12. The semiconductor package asclaimed in claim 8, wherein: the passivation layer includes a firstpassivation layer covering the lowermost redistribution pad and thelowermost redistribution pattern, and a second passivation layer stackedon the first passivation layer, the dummy pad is between the firstpassivation layer and the second passivation layer, the secondpassivation layer has a second opening exposing at least a portion ofthe dummy pad, and the dummy bump fills the second opening.
 13. Thesemiconductor package as claimed in claim 12, wherein the dummy pad islocated on a level lower than the lowermost redistribution pad.
 14. Thesemiconductor package as claimed in claim 12, wherein the dummy pad isspaced apart from the lowermost redistribution pattern by the firstpassivation layer.
 15. The semiconductor package as claimed in claim 12,wherein: the first opening passes through the first passivation layerand the second passivation layer, and the second opening passes throughthe second passivation layer.
 16. The semiconductor package as claimedin claim 12, wherein the dummy structure further includes a dummyunder-bump metal between the dummy pad and the dummy bump andelectrically connecting the dummy pad and the dummy bump.
 17. Thesemiconductor package as claimed in claim 12, wherein the firstpassivation layer and the second passivation layer include a samematerial.
 18. A semiconductor package, comprising: a redistributionstructure including one or more insulating layers, and a redistributionpad and a redistribution pattern on a lower surface of a lowermostinsulating layer among the one or more insulating layers andelectrically connected to each other; a semiconductor chip on theredistribution structure and electrically connected to theredistribution pad and the redistribution pattern; a passivation layercovering the redistribution pad and the redistribution pattern andhaving an opening exposing the redistribution pad; a connection bumpdisposed in the opening of the passivation layer; and a dummy bump on alower surface of the passivation layer, wherein a distance between thelower surface of the lowermost insulating layer and an upper end of theconnection bump is less than a distance between the lower surface of thelowermost insulating layer and an upper end of the dummy bump.
 19. Thesemiconductor package as claimed in claim 18, wherein: theredistribution pad and the redistribution pattern are provided as aplurality of redistribution pads and a plurality of redistributionpatterns, located on a same level to each other, respectively, theopening is provided as a plurality of openings that expose at least aportion of each of the plurality of redistribution pads, the connectionbump is provided as a plurality of connection bumps respectivelydisposed in each of the plurality of openings, the dummy bump isprovided as a plurality of dummy bumps respectively spaced apart fromthe plurality of connection bumps, and at least a portion of theplurality of dummy bumps is disposed in a region directly below theplurality of redistribution patterns.
 20. The semiconductor package asclaimed in claim 18, wherein: the dummy bump is provided as a pluralityof dummy bumps, and at least a portion of the plurality of dummy bumpsdoes not vertically overlap the redistribution pad and theredistribution pattern.